Tethon 3D
Bison Silicon Carbide
Ceramic-Filled
Semiconductor fixtures, heat exchangers, extreme abrasion wear parts; Open 385-405nm
Full specifications
Mechanical
- Tensile strength
- 85 MPa
- Elongation at break
- 0.9 %
- Flexural strength
- 145 MPa
- Flexural modulus
- 11500 MPa
- Izod impact (notched)
- 12 J/m
- Shore hardness
- 95D
- Compressive strength
- 190 MPa
Thermal
- HDT @ 0.45 MPa
- 280 °C
- HDT @ 1.82 MPa
- 210 °C
- Glass transition
- 240 °C
- Max service temp
- 200 °C
Curing & print
- Viscosity @ 25°C
- 2400 cP
- Cure wavelength
- 385-405nm nm
- Post-cure
- Thermal debinding and inert furnace sintering
- Shrinkage / accuracy
- 0.30%
- Water-washable
- No
Physical
- Density
- 1.95 g/cm³
- Available colors
- Dark Grey
- Biocompatibility
- High thermal conductivity ceramic resin