Nexa3D
xESD
Specialty
Static dissipative electronics carriers, wafer handling fixtures, SMT jigs; Nexa3D LSPc
MSRP
$190 /kg
- Technology
- Resin
- Data confidence
- —
Full specifications
Mechanical
- Tensile strength
- 46 MPa
- Elongation at break
- 15 %
- Flexural strength
- 75 MPa
- Flexural modulus
- 1900 MPa
- Izod impact (notched)
- 38 J/m
- Shore hardness
- 80D
- Compressive strength
- 62 MPa
Thermal
- HDT @ 0.45 MPa
- 68 °C
- HDT @ 1.82 MPa
- 55 °C
- Glass transition
- 70 °C
- Max service temp
- 55 °C
Curing & print
- Viscosity @ 25°C
- 850 cP
- Cure wavelength
- 405nm nm
- Post-cure
- 30 min UV chamber
- Shrinkage / accuracy
- 1.30%
- Water-washable
- No
Physical
- Density
- 1.16 g/cm³
- Available colors
- Black
- Biocompatibility
- ANSI/ESD STM11.11 surface resistivity 10^7-10^9 Ω
