Nexa3D
xCE-White
Ceramic-Filled
High-temperature tooling inserts, semiconductor test sockets, fluid manifolds; Nexa3D LSPc & Open 405nm
Full specifications
Mechanical
- Tensile strength
- 82 MPa
- Elongation at break
- 2.2 %
- Flexural strength
- 145 MPa
- Flexural modulus
- 5200 MPa
- Izod impact (notched)
- 18 J/m
- Shore hardness
- 91D
- Compressive strength
- 140 MPa
Thermal
- HDT @ 0.45 MPa
- 260 °C
- HDT @ 1.82 MPa
- 210 °C
- Glass transition
- 230 °C
- Max service temp
- 190 °C
Curing & print
- Viscosity @ 25°C
- 850 cP
- Cure wavelength
- 405nm nm
- Post-cure
- Thermal bake 120 min @ 160°C
- Shrinkage / accuracy
- 0.50%
- Water-washable
- No
Physical
- Density
- 1.45 g/cm³
- Available colors
- White
- Biocompatibility
- Ceramic nanocomposite high heat